4/10/2023 0 Comments Solder reflow station![]() It's optimal for cooling rate to reach the range from 1☌ to 3☌ per second. It's optimal for temperature rise rate to reach 2☌ to 3☌ per second.Ĭooling phase contains two cooling modes: air cooling and natural cooling. It's best to set the highest temperature in soldering phase to be in the range from 200☌ to 210☌ and peak temperature of components shouldn't exceed 220☌. Duration time should be controlled within the range from 60 seconds to 120 seconds when temperature is over 183☌. Soldering phase has to witness the temperature of solder joints quickly climbing to the soldering temperature. Temperature should be maintained at approximately 170☌ within 60 to 120 seconds. The extent of hot melting directly determines soldering quality of solder joints. The target of soaking phase is to get hot melting sufficiently achieved and temperature of all the solder joints on PCB can be as close to soldering temperature. ![]() It's optimal for temperature rise to reach a rate of 1.5☌ per second. Meanwhile, the temperature of PCB devices can be sufficiently high for wettability achievement of solder. As a result, those substances won't lead solder to be splashed or base to be over-heated. Preheating phase is usually composed by 2 to 4 heating zones with temperature constantly going up to 150☌ within 2 minutes so that volatile substances in solder paste can be volatilized out. Due to particularity of BGA package components, this article will discuss reflow soldering technology with PBGA as an example. Then, BGA components will go through reflow soldering in reflow soldering oven. Second, pick and place machine is used to make BGA components placed onto PCB pad array with full alignment. First, solder paste is printed on pad array on PCB through the application of stencil or flux is coated onto pad. Compatible with packaging requirement of MCM (multi-chip module), leading to high density and high performance achievement of MCM.īasically, BGA package assembly is compatible with SMT assembly procedure. Include short pins that signal paths are thereafter short with lead inductance and capacitance reduced and electrical performance improved Feature solid pins, which is different from pin deformation occurring to QFP (quad flat package) Į. Evidently defeat coplanarity issue and greatly reduce coplanar damage ĭ. Dramatically improve component pins while decreasing package size, reducing the application area of base Ĭ. Sensitive to both humidity and heat, perhaps leading to relatively low reliability īased on the brief introduction of different categories of BGA packages, features of BGA package components can be summarized into the following:ī. ![]() Capable of aligning with PCB pad through package edge ĭ. Brings forward good hot pressing matching with PCBs using epoxy resin as substrate material ī. Characteristics of TBGA package contain:Ī. TBGA is a type of package taking advantage of tape interconnection for connection achievement between chip, solder balls and PCB. It's difficult for alignment between package edge and PCB to take place, leading to a high cost of packaging. Due to different coefficients of thermal expansion, CBGA features bad hot pressing matching with PCB boards applying epoxy resin as substrate so that solder joint fatigue has become the primary failure type of CBGA į. Features good coplanarity that is approximately 100μm and solder joints are easily generated Į. CBGA features the following characteristics:ī. Solder balls belonging to CBGA are manufactured by high-temperature solder, which are then connected with ceramic base through the application of eutectic solder with a low melting point (usually 63Sn/Pb) that is then leveraged to make solder balls connected with PCB (printed circuit board). Can be accurately aligned with PCB pad through package edge. Solder balls contribute to the generation of solder joints, leading to flexible coplanarity that is approximately 250μm Į. Features excellent hot pressing matching with epoxy resin ī. PBGA places solder balls on the base with the following properties:Ī. ![]() Up to now, BGA package can be classified into three categories in accordance with base types: PBGA (plastic ball grid array), CBGA (ceramic ball grid array), TBGA (tape ball grid array).
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